Assalamualaikum..
Today is my first day at HITECH INTERGRATED INOVATION SOLUTION SDN BHD or knownly as HISS for my intership.
Always A Pioneer Always Ahead
Registration on 25 June 2012 at HITECH INTERGRATED INOVATION SOLUTION SDN BHD
Background
Associate Professor Dr Abdul Rani bin Othman
Dean
Faculty of Electronics and Computer Engineering
Universiti Teknikal Malaysia Melaka
Mazran bin Esro
First day on the touch
briefing the project have been develop by the company, where the dealing or directed project to, the briefing of the most of component of electronics.
- SAMB sdn bhd is the one of the company that HITECH was supplier the product
- SAMB is located at wisma persekutuan MITC - The fist product have been installed is "water level detection".
The briefing the components and tools.
- solder tool and solder lead.
-the knowledge of the components is less.
Two type of component "surface mount technology"
- SMD (surface mount device).
- through hole device
-the knowledge of the components is less.
Two type of component "surface mount technology"
- SMD (surface mount device).
- through hole device